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Precision Polishing Machine Product List and Ranking from 8 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

Precision Polishing Machine Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. アイエムティー Wakayama//Testing, Analysis and Measurement
  2. ムサシノ電子 Tokyo//Industrial Machinery
  3. null/null
  4. 4 シーケービー Tokyo//Trading company/Wholesale
  5. 4 null/null
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Precision Polishing Machine Product ranking

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. OTEC / Precision Polishing Device "Drag Finish Machine" シーケービー
  2. Precision Grinding Machine 'IS-POLISHER ISPP-1000'
  3. [Column] Episode 1 Part 1 - Everything Started with Meeting IMT - アイエムティー
  4. [Column] Episode 2 Part 1 - Solve the Drainage Problem - アイエムティー
  5. 4 [Column] Episode 1 Part 2 - Everything Started with the Encounter with IMT - アイエムティー

Precision Polishing Machine Product List

1～15 item / All 21 items

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OTEC / Precision Polishing Device "Drag Finish Machine"

OTEC / Precision Polishing Device "Drag Finish Machine"

Compact and economical! It is widely used in the tool manufacturing and medical fields.

The DF series features a three-axis drive system. It is a device capable of precision polishing, from improving surface roughness (coarse and medium grinding) to finishing polishing (mirror finish), in a very short processing time. The workpiece is mounted on a rotating holder (rotation), which is fixed to a driven holder that rotates multiple pieces together (revolution). Furthermore, this unit is attached to multiple main rotating rotors and rotates (revolution). In other words, the workpiece is polished while being submerged and pressed against the polishing abrasive, undergoing a complex combination of self-rotation and revolution in three axes.

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  • Other processing machines

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Precision Grinding Device "MA-400e"

Precision Grinding Device "MA-400e"

High-precision angular bearings are adopted as the main axis! Achieving a flatness accuracy of ±10μm on the reference table.

The "MA-400e" is a precision grinding device with a spindle directly mounted on a surface plate that has been ground and finished with high precision. The brushless DC motor allows for high-precision grinding as there is no change in rotational speed due to load fluctuations. By combining the automatic grinding mechanism's roller holding unit, roller-type swinging holding unit, and various sample holders, we have achieved high-precision automatic grinding for electronic materials, electronic components, ceramics, metal materials, as well as for the pretreatment of TEM, SEM, SIMS samples, and orientation using X-rays. 【Features】 - The spindle is directly mounted on a surface plate that has been ground and finished with high precision. - High-precision angular bearings are used in the spindle. - Achieves flatness accuracy within ±10μm on the reference table. - The brushless DC motor allows for high-precision grinding as there is no change in rotational speed due to load fluctuations. *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines

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Precision Grinding Device "MA-300e"

Precision Grinding Device "MA-300e"

Interlock covers are also available! We have achieved further efficiency in polishing operations.

The "MA-300e" is a precision polishing device suitable for polishing large samples such as 3-inch and 4-inch specimens. By installing automatic sample holding units in three locations, it achieves further efficiency in polishing operations. Additionally, by equipping a shaking device, it is expected to improve polishing accuracy and maintain the flatness of the polishing disc. It adopts a sequence control program, allowing for centralized management of the polishing process recipes. 【Features】 - Suitable for polishing large samples such as 3-inch and 4-inch specimens - Three automatic sample holding units installed for further efficiency in polishing operations - Adopts a sequence control program for centralized management of polishing process recipes - Equipped with a leakage breaker and emergency stop button for safe and secure polishing operations - Interlock cover also available *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines

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Precision Grinding Device "MA-200e"

Precision Grinding Device "MA-200e"

Ideal for sample preparation for research and development! Successfully reduced vibration and noise significantly.

The "MA-200e" is a precision grinding device that is highly accurate and suitable for sample preparation in research and development. With the emergency stop button, leakage breaker, and interlock cover (optional), it enables grinding operations with a focus on safety and security. Additionally, it is now possible to manage a wide variety of grinding processes and recipes collectively via a touch panel. 【Features】 ■ Highly accurate and suitable for sample preparation in research and development ■ Improved drive system and rigidity successfully reduce vibration and noise significantly ■ Comfortable operation with digital control using an LCD touch panel ■ Ability to collectively manage a wide variety of grinding processes and recipes via the touch panel ■ Enables grinding operations with a focus on safety and security *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines

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Precision Grinding Device MA Series

Precision Grinding Device MA Series

Reproducibility in sample grinding

By selecting a suitable sample holder for the sample, various shapes and processing purposes for polishing can be achieved. This is a tabletop precision polishing device that is optimal for sample preparation for TEM and SEM observation. Additionally, by replacing the polishing disc and polishing agents, it can handle everything from rough polishing to mirror finishing and CMP (Chemical Mechanical Polishing) with just one unit. 【Examples of materials with processing achievements】 - Semiconductor materials: Si / SiC / GaN / GaAs / InP / Ga2O3 … - Optical materials: Glass / Sapphire / CLBO / YiG / GGG … - Ceramic materials: Alumina / Silicon Nitride … Furthermore, we have numerous achievements with other materials such as metals, minerals, and biological samples.

  • Wafer processing/polishing equipment

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Mechatronics in the field of engineering

Mechatronics in the field of engineering

Introducing polishing (lapping) processing technology with nanometer precision through load control!

Hitachi Information and Communication Engineering collaborates with customers to design and develop dedicated equipment tailored to their needs, proposing solutions that integrate IT data. Focusing on load control technology, we possess various technologies such as positioning technology, measurement technology, and control technology (software), enabling polishing (lapping) with nanometer precision. Our production equipment-related products mainly handle storage-related production equipment, such as hard disk drives and optical discs. Utilizing the technologies and know-how accumulated within this field, we are expanding our range of equipment products for various applications. 【Features】 ■ High-precision polishing technology (load control technology) ■ Production equipment-related products ■ Micro-component handling technology ■ Precision tool manufacturing technology *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services

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"Pre-processing machine for research and development" Ultra-precision polishing device 'PERET'

"Pre-processing machine for research and development" Ultra-precision polishing device 'PERET'

A precision grinding device that even beginners can easily use! Difficult high-precision pre-processing can be done by anyone! Ultra-low angle diagonal grinding and relief grinding that make deep grinding possible!

"PERET" is a polishing device for pre-analysis treatment during sample preparation, developed from MSE technology, aimed at observation and analysis. Our new product "PERET" addresses the following concerns: "I want to perform polishing more precisely and see cross-sections at a 1μ scale." "I want to conduct advanced analysis with the microscope I have." It is designed to solve the problems faced by customers in research and development departments and product analysis. With angled polishing, it enables depth-direction observation and analysis using SEM or XPS over a wide area from a single polished surface. Additionally, relief polishing allows for precise observation and analysis of defects and material distribution within a large area of the polished surface. 【Features】 ■ Does not cause chemical alteration that occurs from nm-level removal ■ Relief polishing, angled polishing, and polishing without resin alteration ■ High-resolution polishing at 10nm increments ■ Polishing that brings cross-sections to the surface *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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[Column] Episode 1 Part 1 - Everything Started with Meeting IMT -

[Column] Episode 1 Part 1 - Everything Started with Meeting IMT -

I'm graduating from hand polishing!

Every day after joining the company, I receive strict guidance on hand polishing from my supervisor. It's difficult to grind parallel, and it takes a whole day to finish just one piece. Colleagues from other departments often ask, "Why is that new employee standing there all day?" It's a bit tough... One day, I searched for sample polishing on Ipros and found IMT, which ranked first in the search results. When I requested information, a cheerful and friendly salesman came to see me right away and offered to help. He introduced me to the IM-P2 and SP-L1, providing detailed explanations. (For uses not listed in the catalog, please inquire.) I convinced my supervisor and got permission to conduct a demo of the IM-P2/SP-L1. [To be continued in the next part]

  • Wafer processing/polishing equipment

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[Case Study Presentation!] Sanxin's Film Polishing Technology - Case Studies for Solving Problems

[Case Study Presentation!] Sanxin's Film Polishing Technology - Case Studies for Solving Problems

We want to reduce the man-hours for grinding! We will design according to your needs, such as wanting to use a different type of polishing instead of whetstone grinding! We are currently offering a collection of case studies that solve problems!

Sanshin Co., Ltd. is a manufacturer that designs and manufactures tape polishing machines based on technology, experience, and years of proven results, tailored to your needs. "The Collection of Case Studies on Sanshin's Film Polishing Technology" is a compilation of case studies on the film polishing technology handled by Sanshin Co., Ltd. It covers the basics of film polishing, the characteristics of Sanshin films, and the Sanshin technology that meets a wide variety of needs. We also introduce case studies from medical device manufacturers, automotive parts manufacturers, and electronic device manufacturers. ■ There is dirt after the final process, and strong cleaning agents cannot be used, making it impossible to remove the dirt... ■ We want to improve the roughness of the ball screw groove to reduce noise and enhance rolling performance. ■ We want to remove burrs that appear when making small holes in flat plates. Sanshin can solve these problems! 【Featured Case Studies】 ■ Medical Device Manufacturer - Proposed an outer diameter polishing device. ■ Automotive Parts Manufacturer - Proposed an inner diameter polishing device. - Proposed a ball screw polishing device. ■ Electronic Device Manufacturer - Proposed a flat surface polishing device. *We are currently accepting sample tests! For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other abrasives

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Precision Grinding Device Attachment Exchange Type 'KIDF-2065-100'

Precision Grinding Device Attachment Exchange Type 'KIDF-2065-100'

It is possible to perform grinding on corner R surfaces and tapered sections. It also supports inner diameter grinding through attachment replacement.

The 『KIDF-2065-100』 is a state-of-the-art attachment exchangeable polishing device that applies tape polishing technology and accommodates a wide variety of workpiece shapes. Equipped with a rotating mechanism for the polishing head, it can perform polishing not only on the outer surface of cylindrical objects but also on corner R surfaces and tapered sections. Additionally, internal diameter polishing has become possible through the exchange of attachments. 【Features】 ■ The polishing head can be pressed against the workpiece at an angle suitable for the polishing surface. ■ By exchanging the attachments, internal diameter polishing is possible for diameters ranging from φ20 to 65mm and depths up to 100mm. ■ The polishing head can be swung up to 90°, allowing for polishing up to the edge. ■ Environmentally friendly polishing processes are possible. ■ Selection of polishing films suitable for the material of the workpiece can be made. ★ Test processing is always welcome! Please feel free to contact us if you are interested. * For more details, please refer to the PDF materials. Inquiries are also welcome.

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  • イプロス研磨機写真?.jpg
  • イプロス研磨機写真?.jpg
  • Wafer processing/polishing equipment

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[Polishing Example] Precision polishing to prevent cracks and fissures in the inner diameter of holes.

[Polishing Example] Precision polishing to prevent cracks and fissures in the inner diameter of holes.

There is a possibility of cracks occurring from burrs and fine scratches on the inner diameter of holes machined into the workpiece, and this is an example of prevention through precision grinding. *Example gift!

Are there any cracks that occur from burrs or fine scratches on the inner diameter of holes cut into the workpiece? This is an introduction to a case study on precision grinding that prevents cracks from such cut holes. When holes are drilled through cutting, there is a possibility of cracks occurring from burrs or fine scratches. By precision grinding the inner diameter of the hole, scratches can be eliminated, preventing cracks. *For more details, please contact us directly. *Please view the PDF of the case studies available for download.

  • Processing Contract
  • Hand polishing and filing
  • Wafer processing/polishing equipment

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Musashino Electronics Co., Ltd. General Catalog

Musashino Electronics Co., Ltd. General Catalog

High-precision and high-efficiency polishing technology! A comprehensive catalog of precision polishing equipment is available as a gift.

This catalog features products handled by Musashino Electronics Co., Ltd., such as "ultra-precision grinding machines" and "experimental precision scribers." Our grinding machines possess high flatness accuracy on the rotating reference plate due to their structural characteristics, guaranteeing flatness of 5μm or less. In addition to a diverse range of grinding machines, we also introduce various "automatic grinding (sample holding) units" and "flatness correction tools" that respond to the diversifying applications. [Featured Products] ■ Ultra-precision grinding machines ■ Automatic grinding (sample holding) units ■ Flatness correction tools and various auxiliary devices ■ Various sample holders ■ Grinding discs *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Precision Grinding Device "MA-200"

Precision Grinding Device "MA-200"

There is no edge sagging, and there are no detachments of foreign substances, making it suitable for evaluation using methods such as EPMA!

The "MA-200" is a precision polishing device that offers high accuracy and is suitable for sample preparation in research and development. By using polishing discs and abrasives tailored to the samples, better polished surfaces can be achieved, with polishing accuracy of flatness λ/10 or less and surface roughness of 0.01μm or less. It is also suitable for polishing cross-sections of ICs, inclined polishing, and end faces of optical crystals such as LN. 【Features】 ■ High accuracy, suitable for sample preparation in research and development ■ Better polished surfaces can be achieved by using polishing discs and abrasives tailored to the samples ■ Polishing accuracy of flatness λ/10 or less and surface roughness of 0.01μm or less ■ No edge rounding and no detachment of inclusions, making it suitable for evaluation with EPMA and similar techniques ■ Also suitable for polishing cross-sections of ICs, inclined polishing, and end faces of optical crystals such as LN *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines

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Precision Grinding Device "MA-150"

Precision Grinding Device "MA-150"

Ideal for polishing small samples! Designed and developed to allow one machine to be used for one purpose.

The "MA-150" is a personal-type polishing machine designed to be installed next to SEM, EPMA, TEM, etc., allowing one machine to be used for one specific purpose. Its compact size does not take up much space, making it suitable for polishing small samples, and it can polish materials such as semiconductor wafers, sapphire, SiC, glass, and ceramics. By using polishing discs and abrasives tailored to the sample, better polished surfaces can be achieved. 【Features】 ■ Personal-type polishing machine ■ Designed and developed to allow one machine to be used for one specific purpose ■ Better polished surfaces can be obtained by using polishing discs and abrasives suited to the sample ■ Compact size does not occupy much space, making it ideal for polishing small samples ■ Capable of polishing semiconductor wafers, sapphire, SiC, glass, ceramics, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • CMP Equipment
  • Other processing machines

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