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Precision Polishing Machine Product List and Ranking from 8 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Sep 03, 2025~Sep 30, 2025
This ranking is based on the number of page views on our site.

Precision Polishing Machine Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Sep 03, 2025~Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. ムサシノ電子 Tokyo//Industrial Machinery
  2. アイエムティー Wakayama//Testing, Analysis and Measurement
  3. シーケービー Tokyo//Trading company/Wholesale
  4. 4 パルメソ Niigata//Testing, Analysis and Measurement
  5. 5 null/null

Precision Polishing Machine Product ranking

Last Updated: Aggregation Period:Sep 03, 2025~Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. OTEC / Precision Polishing Device "Drag Finish Machine" シーケービー
  2. Precision Grinding Device "MA-200e" ムサシノ電子
  3. "Pre-processing machine for research and development" Ultra-precision polishing device 'PERET' パルメソ
  4. 4 [Column] Episode 2 Part 1 - Solve the Drainage Problem - アイエムティー
  5. 4 [Column] Episode 1 Part 1 - Everything Started with Meeting IMT - アイエムティー

Precision Polishing Machine Product List

1~15 item / All 21 items

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OTEC / Precision Polishing Device "Drag Finish Machine"

Compact and economical! It is widely used in the tool manufacturing and medical fields.

The DF series features a three-axis drive system. It is a device capable of precision polishing, from improving surface roughness (coarse and medium grinding) to finishing polishing (mirror finish), in a very short processing time. The workpiece is mounted on a rotating holder (rotation), which is fixed to a driven holder that rotates multiple pieces together (revolution). Furthermore, this unit is attached to multiple main rotating rotors and rotates (revolution). In other words, the workpiece is polished while being submerged and pressed against the polishing abrasive, undergoing a complex combination of self-rotation and revolution in three axes.

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  • DF-image.jpg
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  • 補足画像-A-2-Tool-Holders.jpg
  • Other processing machines

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[Column] Episode 2 Part 1 - Solve the Drainage Problem -

~Me, Polishing, and IMT~

My company needed improvement... After I had gotten a bit used to the work, my boss presented a new challenge: "I want to do something about the drainage." I contacted IMT, and a salesperson came right away. As always, he greeted me with a refreshing smile, but I felt a bit nervous. "I need to pull myself together," I thought, switching my mindset back to work. When I asked, "How do other companies handle drainage?" I received an explanation that included examples from other companies. I can't say it out loud, but our company's drainage treatment is not good... It's bad. We have to improve somehow. Recently, there has been a need to address SDGs, and I was told that there are many questions like mine. They mentioned that there is a suitable product and introduced me to it. It's the "RYUZIN Filtration System." [To be continued in the next part]

  • Wafer processing/polishing equipment

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Precision Grinding Device "MA-400e"

High-precision angular bearings are adopted as the main axis! Achieving a flatness accuracy of ±10μm on the reference table.

The "MA-400e" is a precision grinding device with a spindle directly mounted on a surface plate that has been ground and finished with high precision. The brushless DC motor allows for high-precision grinding as there is no change in rotational speed due to load fluctuations. By combining the automatic grinding mechanism's roller holding unit, roller-type swinging holding unit, and various sample holders, we have achieved high-precision automatic grinding for electronic materials, electronic components, ceramics, metal materials, as well as for the pretreatment of TEM, SEM, SIMS samples, and orientation using X-rays. 【Features】 - The spindle is directly mounted on a surface plate that has been ground and finished with high precision. - High-precision angular bearings are used in the spindle. - Achieves flatness accuracy within ±10μm on the reference table. - The brushless DC motor allows for high-precision grinding as there is no change in rotational speed due to load fluctuations. *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines

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Precision Grinding Device "MA-300e"

Interlock covers are also available! We have achieved further efficiency in polishing operations.

The "MA-300e" is a precision polishing device suitable for polishing large samples such as 3-inch and 4-inch specimens. By installing automatic sample holding units in three locations, it achieves further efficiency in polishing operations. Additionally, by equipping a shaking device, it is expected to improve polishing accuracy and maintain the flatness of the polishing disc. It adopts a sequence control program, allowing for centralized management of the polishing process recipes. 【Features】 - Suitable for polishing large samples such as 3-inch and 4-inch specimens - Three automatic sample holding units installed for further efficiency in polishing operations - Adopts a sequence control program for centralized management of polishing process recipes - Equipped with a leakage breaker and emergency stop button for safe and secure polishing operations - Interlock cover also available *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines

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Precision Grinding Device "MA-200e"

Ideal for sample preparation for research and development! Successfully reduced vibration and noise significantly.

The "MA-200e" is a precision grinding device that is highly accurate and suitable for sample preparation in research and development. With the emergency stop button, leakage breaker, and interlock cover (optional), it enables grinding operations with a focus on safety and security. Additionally, it is now possible to manage a wide variety of grinding processes and recipes collectively via a touch panel. 【Features】 ■ Highly accurate and suitable for sample preparation in research and development ■ Improved drive system and rigidity successfully reduce vibration and noise significantly ■ Comfortable operation with digital control using an LCD touch panel ■ Ability to collectively manage a wide variety of grinding processes and recipes via the touch panel ■ Enables grinding operations with a focus on safety and security *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines

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Mechatronics in the field of engineering

Introducing polishing (lapping) processing technology with nanometer precision through load control!

Hitachi Information and Communication Engineering collaborates with customers to design and develop dedicated equipment tailored to their needs, proposing solutions that integrate IT data. Focusing on load control technology, we possess various technologies such as positioning technology, measurement technology, and control technology (software), enabling polishing (lapping) with nanometer precision. Our production equipment-related products mainly handle storage-related production equipment, such as hard disk drives and optical discs. Utilizing the technologies and know-how accumulated within this field, we are expanding our range of equipment products for various applications. 【Features】 ■ High-precision polishing technology (load control technology) ■ Production equipment-related products ■ Micro-component handling technology ■ Precision tool manufacturing technology *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services

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"Pre-processing machine for research and development" Ultra-precision polishing device 'PERET'

A precision grinding device that even beginners can easily use! Difficult high-precision pre-processing can be done by anyone! Ultra-low angle diagonal grinding and relief grinding that make deep grinding possible!

"PERET" is a polishing device for pre-analysis treatment during sample preparation, developed from MSE technology, aimed at observation and analysis. Our new product "PERET" addresses the following concerns: "I want to perform polishing more precisely and see cross-sections at a 1μ scale." "I want to conduct advanced analysis with the microscope I have." It is designed to solve the problems faced by customers in research and development departments and product analysis. With angled polishing, it enables depth-direction observation and analysis using SEM or XPS over a wide area from a single polished surface. Additionally, relief polishing allows for precise observation and analysis of defects and material distribution within a large area of the polished surface. 【Features】 ■ Does not cause chemical alteration that occurs from nm-level removal ■ Relief polishing, angled polishing, and polishing without resin alteration ■ High-resolution polishing at 10nm increments ■ Polishing that brings cross-sections to the surface *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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[Column] Episode 1 Part 1 - Everything Started with Meeting IMT -

I'm graduating from hand polishing!

Every day after joining the company, I receive strict guidance on hand polishing from my supervisor. It's difficult to grind parallel, and it takes a whole day to finish just one piece. Colleagues from other departments often ask, "Why is that new employee standing there all day?" It's a bit tough... One day, I searched for sample polishing on Ipros and found IMT, which ranked first in the search results. When I requested information, a cheerful and friendly salesman came to see me right away and offered to help. He introduced me to the IM-P2 and SP-L1, providing detailed explanations. (For uses not listed in the catalog, please inquire.) I convinced my supervisor and got permission to conduct a demo of the IM-P2/SP-L1. [To be continued in the next part]

  • Wafer processing/polishing equipment

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[Column] Episode 1 Part 2 - Everything Started with the Encounter with IMT -

I'm graduating from hand polishing!

I had a worry that I might not be able to polish well. While recalling the days of polishing by hand, I listened to the salesperson's explanation. The result was that a task that used to take a whole day was shortened to about 30 minutes. The parallelism was also well established and satisfactory. I thought I could catch up to the senior's skilled techniques with this. With the polishing time reduced to one day, I was able to do other tasks, making work a bit more enjoyable. The seniors also started using it, and one machine was no longer enough. Overtime has decreased, and my private time has increased. In a fleeting moment, I think about wanting to meet that salesperson from IMT... And then the next challenge arises... 【To be continued】

  • Wafer processing/polishing equipment

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[Column] Episode 2 Part 2 - Solve the Drainage Problem -

~Me, Kenma, and IMT~

When we requested to borrow the demo unit, it was popular, and we had to wait for a rental reservation... Finally, it was our turn! The device looks a bit like a face, which is kind of cute lol. When we actually used it, the water that was supposed to be dirty from polishing became very clean. He said, "Even if you spray circulating water on a 1μm polishing cloth, it won't get scratched." I was skeptical, but when I tried it, it really didn't get scratched. I created a proposal incorporating SDGs. Since it was necessary to consider the environment, it was quickly approved and ordered— Even during delivery, he explained everything diligently, which was reassuring. I want to see him... 【To be continued】 -Manual embedding machine breaks-

  • Wafer processing/polishing equipment

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[Case Study Presentation!] Sanxin's Film Polishing Technology - Case Studies for Solving Problems

We want to reduce the man-hours for grinding! We will design according to your needs, such as wanting to use a different type of polishing instead of whetstone grinding! We are currently offering a collection of case studies that solve problems!

Sanshin Co., Ltd. is a manufacturer that designs and manufactures tape polishing machines based on technology, experience, and years of proven results, tailored to your needs. "The Collection of Case Studies on Sanshin's Film Polishing Technology" is a compilation of case studies on the film polishing technology handled by Sanshin Co., Ltd. It covers the basics of film polishing, the characteristics of Sanshin films, and the Sanshin technology that meets a wide variety of needs. We also introduce case studies from medical device manufacturers, automotive parts manufacturers, and electronic device manufacturers. ■ There is dirt after the final process, and strong cleaning agents cannot be used, making it impossible to remove the dirt... ■ We want to improve the roughness of the ball screw groove to reduce noise and enhance rolling performance. ■ We want to remove burrs that appear when making small holes in flat plates. Sanshin can solve these problems! 【Featured Case Studies】 ■ Medical Device Manufacturer - Proposed an outer diameter polishing device. ■ Automotive Parts Manufacturer - Proposed an inner diameter polishing device. - Proposed a ball screw polishing device. ■ Electronic Device Manufacturer - Proposed a flat surface polishing device. *We are currently accepting sample tests! For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other abrasives

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